Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card

ABSTRACT

A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

BACKGROUND OF THE INVENTION

[0001] (1) Field of the Invention

[0002] The present invention relates to a method and a system formounting a semiconductor device or an electronic component, whichcomprises dicing a semiconductor wafer into semiconductor devices(semiconductor chips) or cutting electronic components attached in a rowon a unit basis, picking up the diced semiconductor devices or the cutelectronic components, and then mounting them on a mounting board suchas a circuit board constructing an IC card or the like; a separatingsystem for the semiconductor device or the electronic component; and anIC card fabricating method.

[0003] (2) Description of the Related Art

[0004] For example, conventional techniques JP-A-6-295930 (hereinafterreferred to as a known example 1) and JP-A-6-97214 (hereinafter referredto as a known example 2) for dicing a semiconductor wafer in a statewhere it is bonded to an adhesive sheet into semiconductor devices(semiconductor chips) and picking up the diced semiconductor deviceswhile peeling them from the adhesive sheet are known.

[0005] The known example 1 describes a technique such that the back faceof an adhesive sheet from which semiconductor chips to be peeled arebonded is rubbed by sliding pins, thereby weakening the adhesivestrength to the semiconductor chips. The semiconductor chips areuniformly lifted by raising pushing pins provided around the slidingpins together with the sliding pins, thereby peeling off thesemiconductor chips having the weakened adhesive strength from theadhesive sheet.

[0006] The known example 2 describes a technique such that an adhesivesheet to which a number of pellets are adhered is fixedly held with theside of the pellets facing downward, a ball shaped lower end of a needleunit forms a face pressing the adhesive sheet and needles each having asharp tip are protruded downward from the needle unit. Consequently, thepellets are peeled from the adhesive sheet and are adsorbed by a colletpositioned below.

[0007] A conventional technique disclosed in JP-A-1-264236 (hereinafterreferred to as a known example 3) for dicing a semiconductor waferadhered to an adhesive sheet into semiconductor devices (semiconductorchips) is also known. The known example 3 describes a wafer breakingtechnique for cutting and separating semiconductor devices in a waferstate into separate devices by pressing a roller having an expandedcentral part against the back face of an adhesive sheet adhered to aframe ring by which a semi-full cut wafer is fixed and moving theroller.

[0008] A semiconductor chip to be mounted on an IC card or the like, forexample, is requested to be thinner from the necessity of reducing thethickness of a product such as an IC card. Consequently, when a productsuch as an IC card is fabricated by mounting a thin semiconductor chipon a circuit board (mounting board) constructing a product such as an ICcard, it is necessary to execute it without damaging or cracking thethin semiconductor chip.

[0009] According to the known example 1, however, since thesemiconductor chip is peeled from the adhesive sheet by lifting thepushing pins provided around the sliding pins together with the slidingpins so as to uniformly lift the semiconductor chip, the separated areais small for the adhesive face of the semiconductor chip. In case ofemploying a thin semiconductor chip, the possibility that the thinsemiconductor chip cannot be separated but is cracked or damaged ishigh.

[0010] According to the known example 2 as well, the pellets are peeledfrom the adhesive sheet by downwardly protruding the needle having thesharp tip. Consequently, in case of the thin semiconductor chip, thepossibility that it cannot be separated but is cracked or damaged ishigh.

[0011] The known example 3 relates to the wafer breaking technique forseparating the semiconductor devices in a wafer state into devices.

[0012] As mentioned above, all of the known examples have not consideredwith respect to a point such that a thin semiconductor wafer adhered toan adhesive sheet is diced into a group of thin semiconductor devices(semiconductor chips) and the group of thin semiconductor devices in arow is peeled from the adhesive sheet and separated from the adhesivesheet by a vacuum collet at high speed without damaging or cracking thesemiconductor device.

SUMMARY OF THE INVENTION

[0013] It is an object of the invention to solve the above problems andto provide a semiconductor device mounting method and a system forfabricating high-quality products by dicing a thin semiconductor waferin a state where it is adhered to an adhesive sheet into thinsemiconductor devices (semiconductor chips), peeling the group of dicedthin semiconductor devices from the adhesive sheet at high speed withoutdamaging or cracking the semiconductor devices, and conveying the groupof peeled semiconductor devices in order to mount on the mounting board.

[0014] It is another object of the invention to provide a semiconductordevice separating system for dicing a thin semiconductor wafer in astate where it is adhered to an adhesive sheet into thin semiconductordevices (semiconductor chips), peeling the group of the diced thinsemiconductor devices in a row from the adhesive sheet at high speedwithout damaging or cracking the semiconductor devices, and separatingthem by a vacuum collet.

[0015] It is still another object of the present invention to provide anelectronic component mounting method and system as well as a separatingsystem for fabricating high-quality products by cutting electroniccomponents in a row adhered to an adhesive sheet on a unit basis,peeling the group of the electronic components from the adhesive sheetat high speed without damaging or cracking the electronic components,conveying the group of peeled electronic components in serial order, andmounting them to the mounting board.

[0016] It is a further object of the present invention to provide an ICcard fabricating method for fabricating high-quality thin IC cardsefficiently at low cost.

[0017] According to the invention, in order to achieve the object, thereis provided a semiconductor device mounting system comprising:separating means for peeling off a group of semiconductor devices for anobject obtained by dicing a semiconductor wafer adhered to an adhesivesheet from the adhesive sheet; conveying means for conveying the groupof semiconductor devices peeled from the adhesive sheet by theseparating means in serial order to a mounting position; and mountingmeans for relatively positioning an electrode formed in thesemiconductor device conveyed by the conveying means and an electrodeformed on the mounting board and mounting the semiconductor device ontothe mounting board.

[0018] According to the invention, there is provided a semiconductordevice mounting system comprising: separating means for peeling a groupof semiconductor devices in a row for an object obtained by dicing asemiconductor wafer adhered to an adhesive sheet from the adhesive sheetin such a manner that a member having a tip in a projecting shape(including a ball shape) or a curved shape is pushed up against the backface of the adhesive sheet to thereby apply tension to the adhesivesheet and the member is moved from one end of the adhesive sheet to theother end; conveying means for conveying the group of semiconductordevices peeled from the adhesive sheet by the separating means in serialorder to a desired mounting position one by one; and mounting means forrelatively positioning an electrode formed in the semiconductor deviceconveyed by the conveying means and an electrode formed on the mountingboard and mounting the semiconductor device onto the mounting board.

[0019] According to the invention, the separating means in thesemiconductor device mounting system is characterized in that a pressingforce of the member applied to the back face of the adhesive sheet or apress displacement is controlled. According to the invention, theseparating means in the semiconductor device mounting system ischaracterized in that a pressing force of the member to the back face ofthe adhesive sheet or a press displacement is controlled so that thesemiconductor devices are peeled from the adhesive sheet without beingcracked. The separating means in the semiconductor device mountingsystem is characterized in that a pressing force of the member to theback face of the adhesive sheet or a press displacement is controlled inaccordance with the position of the member in the back face of theadhesive sheet.

[0020] According to the invention, there is provided a semiconductordevice mounting system comprising: separating means for peeling anadhesive sheet from a group of semiconductor devices in a row amongsemiconductor devices for an object obtained by dicing a semiconductorwafer adhered to the adhesive sheet by clamping an end of the adhesivesheet and pulling the adhesive sheet at least in the direction along theface of the adhesive sheet in a state where the group of semiconductordevices is held by a chuck; conveying means for conveying the group ofsemiconductor devices peeled from the adhesive sheet by the separatingmeans in serial order to a mounting position; and mounting means forrelatively positioning an electrode formed in the semiconductor deviceconveyed by the conveying means and an electrode formed on the mountingboard and mounting the semiconductor device onto the mounting board.

[0021] According to the invention, there is also provided a system ofmounting semiconductor device comprising: separating means for peelingan adhesive sheet from a group of the semiconductor devices in a row foran object obtained by dicing a semiconductor wafer adhered to theadhesive sheet by clamping an end of the adhesive sheet and pulling theadhesive sheet at least in the direction along the face of the adhesivesheet while the adhesive sheet is forming a bending shape in a statewhere the group of semiconductor devices is held by a chuck; conveyingmeans for conveying the group of semiconductor devices peeled from theadhesive sheet by the separating means in serial order to a mountingposition; and mounting means for relatively positioning an electrodeformed in the semiconductor device conveyed by the conveying means andan electrode formed on the mounting board and mounting the semiconductordevice onto the mounting board.

[0022] According to the invention, separating means in the semiconductordevice mounting system is characterized in that a forming mechanism forforming a bending shape of the adhesive sheet peeled from thesemiconductor devices in a linear shape part moves in accordance withthe movement of the peeled linear shaped part when the adhesive sheet ispeeled by being pulled. The above forming mechanism is characterized incomprising a wedge-shaped jig located in the bending part of theadhesive sheet. The forming mechanism is also characterized incomprising a member pressing the bending part of the adhesive sheet.

[0023] According to the invention, the separating means is characterizedin that a periphery of the adhesive sheet is fixed to that of the chuck.According to the invention, the separating means is characterized inthat the direction of pulling the adhesive sheet is the same to that ofarranging semiconductor device on the face of the adhesive sheet.According to the invention, the separating means is characterized inthat the direction of pulling the adhesive sheet tilts against thedirection of semiconductor devices on the face of the adhesive sheet.

[0024] According to the invention, the semiconductor device mountingsystem is characterized in that the plurality of separating means isdisposed so that a face of an object turns sidelong.

[0025] According to the invention, there is also provided a method ofmounting a semiconductor device comprising: a separating step of peelingoff a group of semiconductor devices in a row for an object obtained bydicing a semiconductor wafer adhered to an adhesive sheet from theadhesive sheet; a conveying step of conveying the group of semiconductordevices peeled from the adhesive sheet by the separating means in serialorder to a mounting position; and a mounting step of relativelypositioning an electrode formed in the semiconductor device conveyed inthe conveying step and an electrode formed on a mounting board andmounting the semiconductor device onto the mounting board.

[0026] According to the invention, there is also provided a method ofmounting a semiconductor device comprising: a separating step of peelingoff a group of semiconductor devices in a row among semiconductordevices for an object obtained by dicing a semiconductor wafer adheredto an adhesive sheet from the adhesive sheet in such a manner that amember having a tip in a projecting shape or a curved shape is pushed upagainst the back face of the adhesive sheet thereby to give tension tothe adhesive sheet and the member is moved from one end of the adhesivesheet to the other end; a conveying step of conveying the group ofsemiconductor devices peeled from the adhesive sheet in the separatingstep in serial order to a mounting position; and a mounting step ofrelatively positioning an electrode formed in the semiconductor deviceconveyed in the conveying step and an electrode formed on a mountingboard and mounting the semiconductor device onto the mounting board.

[0027] According to the invention, there is also provided asemiconductor device mounting method comprising: a separating step ofpeeling off an adhesive sheet from a group of semiconductor devices in arow for an object obtained by dicing a semiconductor wafer adhered tothe adhesive sheet by clamping an end of the adhesive sheet and pullingthe adhesive sheet at least in the direction along the face of theadhesive sheet in a state where the group of semiconductor devices areheld by a chuck; a conveying step of conveying the group ofsemiconductor devices peeled from the adhesive sheet in the separatingstep in serial order to a mounting position; and a mounting step ofrelatively positioning an electrode formed in the semiconductor deviceconveyed in the conveying step and an electrode formed on the mountingboard and mounting the semiconductor device onto the mounting board.

[0028] According to the invention, there is provided a semiconductordevice mounting method comprising: a separating step of peeling anadhesive sheet from a group of semiconductor devices in a row amongsemiconductor devices as an object obtained by dicing a semiconductorwafer adhered to the adhesive sheet by clamping an end of the adhesivesheet and by pulling the adhesive sheet at least in the direction alongthe face of the adhesive sheet in a state where the group ofsemiconductor devices are held by a chuck; a conveying step of conveyingthe group of semiconductor devices peeled from the adhesive sheet in theseparating step in serial order in a desired unit to a mounting positionon a semiconductor device unit basis; and a mounting step of relativelypositioning an electrode formed in the semiconductor device conveyed inthe conveying step and an electrode formed on a mounting board andmounting the semiconductor device onto the mounting board.

[0029] According to the invention, there is provided a semiconductordevice mounting method comprising: a separating step for peeling anadhesive sheet from a group of semiconductor devices in a row for anobject obtained by dicing a semiconductor wafer adhered to the adhesivesheet by clamping an end of the adhesive sheet and pulling the adhesivesheet at least in the direction along the face of the adhesive sheetwhile forming the bending shape of the adhesive sheet in a state wherethe group of semiconductor devices is held by a chuck; a conveying stepfor conveying the group of semiconductor devices peeled from theadhesive sheet in the separating step in serial order to a mountingposition; and a mounting step for relatively positioning an electrodeformed in the semiconductor device conveyed in the conveying step and anelectrode formed on the mounting board and mounting the semiconductordevice onto the mounting board.

[0030] A semiconductor device separating system for peeling a group ofsemiconductor devices in a row among semiconductor devices for an objectobtained by dicing a semiconductor wafer adhered to the adhesive sheetfrom the adhesive sheet in such a manner that a member having a tip in aprojecting or curved shape is pushed up against the back face of theadhesive sheet to thereby apply tension to the adhesive sheet and themember is moved from one end to the other end of the adhesive sheet.

[0031] According to the invention, there is also provided asemiconductor device separating system for peeling an adhesive sheetfrom a group of semiconductor devices in a row among semiconductordevices for an object obtained by dicing a semiconductor wafer adheredto the adhesive sheet by clamping an end of the adhesive sheet andpulling the adhesive sheet at least in the direction along the face ofthe adhesive sheet in a state where the group of semiconductor devicesis held by a chuck.

[0032] According to the invention, the semiconductor device separatingsystem is characterized in that a forming mechanism for forming abending shape of the adhesive sheet peeled from the semiconductordevices in a linear shape part moves in accordance with the movement ofthe above mentioned peeled linear shape part when the adhesive sheet ispeeled by being pulled.

[0033] The above mentioned forming device is characterized in comprisinga wedge-shaped tool located in the bending part of the adhesive sheet.The forming device is also characterized in comprising a member pressingthe bending part of the adhesive sheet. And according to the invention,it is characterized in that a periphery of the above mentioned adhesivesheet is fixed to that of the chuck. According to the invention, it ischaracterized in that the direction of pulling the adhesive sheet is thesame to that of arranging semiconductor devices on the face of theadhesive sheet. According to the invention, it is characterized in thatthe direction of pulling the adhesive sheet tilts against the directionof semiconductor devices on the face of the adhesive sheet. Andaccording to the invention, the chuck face holding the group ofsemiconductor devices is characterized in being coated with a fluorineresin film.

[0034] According to the invention, the method and system for mountingsemiconductor device and the separating system are characterized in thatinstead of the semiconductor wafer, electronic components like chip-sizepackages are attached in row with boards or tapes.

[0035] And, according to the invention, there is provided an IC cardfabricating method comprising: a step for forming conductor patterns ona single side of a film; a mounting step for peeling the group of thesemiconductor devices from the adhesive sheet for an object obtained bydicing a semiconductor wafer adhered to the adhesive sheet, conveyingthe group of the peeled semiconductor devices in serial order to themounting position, and relatively positioning and mounting an accessterminal of the conveyed semiconductor devices to the conductor patternformed in the above conductor pattern forming step, and fixing theconductor devices to the film with a temporary fixing fluid; and alaminating step for heating/pressing and laminating an adhesive coverfilm on a single side of the film, and connecting an access terminal ofthe semiconductor devices fixed to the film to the conductor pattern.

[0036] According to the invention, the conductor pattern forming step inthe IC card fabricating method is characterized in forming a conductorpattern by printing a conductor paste in a desired pattern on the singleside of the film and drying the printed conductor paste.

[0037] According to the invention, a mounting step in the IC cardfabricating method is characterized in peeling the adhesive sheet fromthe group of semiconductor devices for the object obtained by dicing asemiconductor wafer adhered to the adhesive sheet, by clamping an end ofthe adhesive sheet and pulling the adhesive sheet at least in thedirection along the face of the adhesive sheet in a state where thegroup of the semiconductor devices is held by a chuck, conveying thegroup of peeled semiconductor devices in serial order to the mountingposition, relatively positioning and mounting an access terminal of theconveyed semiconductor device to the conductor pattern formed in theconductor pattern forming step and fixing the semiconductor device inthe film with a temporary fixing fluid.

[0038] According to the invention, there is provided an IC cardfabricating method comprising: a conductor pattern forming step forforming a conductor pattern on a single side of a film; a mounting stepfor peeling a group of semiconductor devices from the adhesive sheet foran object obtained by dicing a semiconductor wafer adhered to anadhesive sheet, conveying the group of peeled semiconductor devices inserial order to the mounting position, and relatively positioning andmounting the access terminal of the conveyed semiconductor devices tothe conductor pattern formed in the conductor pattern forming step; alaminating step for heating/pressing an adhesive cover film on a singleside of the film and connecting the access terminal of the mountedsemiconductor device to the conductor pattern.

[0039] As mentioned above, by using the constructions, a thinsemiconductor wafer which has the thickness of about 0.002 to 0.2 mm andis adhered to an adhesive sheet is diced into thin semiconductor devices(semiconductor chips), the group of diced thin semiconductor devices ispeeled from an adhesive sheet at high speed without damaging andcracking the semiconductor devices, separated by a vacuum collet, andmounted on a mounting board (circuit board), thereby enabling ahigh-quality thin product such as an IC card to be fabricated.

[0040] According to the construction above, it is possible to fabricatea high-quality products by cutting electronic components in row adheredto an adhesive sheet on a unit basis, peeling the group of cutelectronic components from an adhesive sheet at high speed withoutdamaging and cracking the electronic components, separating them by avacuum collet, and mounting them as they are on a mounting board(circuit board).

[0041] According to the construction above, it is possible to fabricatea high-quality thin IC card efficiently at low cost.

BRIEF DESCRIPTION OF THE DRAWINGS

[0042]FIG. 1 is a schematic construction diagram showing a firstembodiment of a whole system for dicing a thin semiconductor wafer intothin semiconductor chips and mounting the thin semiconductor chips on acircuit board constructing an IC card or the like according to theinvention;

[0043]FIGS. 2A to C are a diagram for explaining a method of fabricatinga work supplied to an separation mechanism part according to theinvention;

[0044]FIG. 3 is a front cross section of the work for explaining theprinciple of the separation mechanism part according to the invention;

[0045]FIG. 4 is a side cross section of FIG. 3;

[0046]FIG. 5 is a plan view of the work for explaining the principle ofthe separation mechanism part according to the invention;

[0047]FIGS. 6A to C are a diagram showing a state in which semiconductorchips are peeled from an adhesive sheet when a roller or ball member forpeeling chips according to the invention is raised and moved;

[0048]FIGS. 7A and B are a diagram showing change in tension applied tothe adhesive sheet and change in a separation angle θ in accordance witha position along the adhesive sheet face in the roller or ball memberfor peeling chips according to the invention;

[0049]FIG. 8 is a front view showing a schematic construction of a firstembodiment of the separation mechanism part according to the invention;

[0050]FIGS. 9A to D are a diagram showing a process in which a group ofsemiconductor chips in a row is peeled from the adhesive sheet when theroller or ball member for peeling chips is lifted and moved in the firstembodiment of the separation mechanism part according to the invention;

[0051]FIGS. 10A to C are a diagram showing a process in which the groupof semiconductor chips in the row peeled from the adhesive sheet isadsorbed by a vacuum collet subsequent to FIG. 9;

[0052]FIGS. 11A and B are a diagram showing a process in which the groupof semiconductor chips in the row adsorbed by the vacuum collet isconveyed onto a conveyer subsequent to FIG. 10;

[0053]FIG. 12 is a front view showing a schematic construction of asecond embodiment of the separation mechanism part according to theinvention;

[0054]FIGS. 13A to C are a diagram showing a stage on which the work isput and the movement of the roller or ball member for peeling chips inthe separation mechanism part according to the invention;

[0055]FIG. 14 is a front cross section showing a schematic constructionof a third embodiment of the separation mechanism part according to theinvention;

[0056]FIGS. 15A to D are a front view showing a schematic constructionand an operation process of a fourth embodiment of the separationmechanism part according to the invention;

[0057]FIGS. 16A to E are a specific construction diagram showing thefirst embodiment of the whole system for dicing the thin semiconductorwafer into thin semiconductor chips and mounting the semiconductor chipsonto the circuit board constructing the IC card or the like according tothe invention;

[0058]FIGS. 17A to C are a diagram showing defective semiconductor chipsin a coordinate system set on the semiconductor wafer in the workaccording to the invention;

[0059]FIGS. 18A to D are a diagram for explaining calculation of theposition of an electrode formed on a semiconductor chip by using avacuum nozzle which is a reference on the semiconductor chip as areference;

[0060]FIGS. 19A to D are a diagram for explaining the principle of theseparation mechanism part in a second embodiment of the whole system fordicing a thin semiconductor wafer into thin semiconductor chips andmounting the semiconductor chips onto a circuit board constructing an ICcard or the like according to the invention;

[0061]FIG. 20 is a diagram showing the relation between the directionangle ψ of the pulling force F which acts against the surface of thesemiconductor chips and the forces Fx and Fy which act to thesemiconductor chips when peeled from the group of thin semiconductorchips by the pulling force F acting on the adhesive sheet in a secondembodiment;

[0062]FIGS. 21A and B are a perspective view showing a state in whichthe adhesive sheet is peeled from a group of the semiconductor chips byusing a wedge-shaped angle fixing jig for peeling in a secondembodiment;

[0063]FIGS. 22A to D are a diagram explaining the principle of theseparation mechanism part when a wedge-shaped peeling angle fixing jigin a second embodiment of the whole system is used;

[0064]FIGS. 23A to C are an enlarged view showing a state in which theadhesive sheet is peeled from semiconductor chips, forming the bendingpart of the adhesive sheet by using a wedge-shaped peeling angle fixingjig or other means;

[0065]FIG. 24 is a view showing that a surface of a chuck is coated witha fluorine resin film;

[0066]FIGS. 25A to D are a diagram explaining the principle of theseparation mechanism part when a row of the semiconductor chips ispressed by a pressing means to follow the peeling shape fixing jig shownin FIG. 22;

[0067]FIGS. 26A to D are a diagram explaining the principle of theseparation mechanism part when the part of the adhesive sheet peeledfrom semiconductor chips in a second embodiment of the whole system islightly pressed with a rotatable roller;

[0068]FIG. 27A to D are a diagram showing a case when a periphery of theadhesive sheet is fixed to that of a chuck;

[0069]FIG. 28 is a construction diagram of the separation mechanism partin the second embodiment of the whole system for dicing the thinsemiconductor wafer into thin semiconductor chips and mounting thesemiconductor chips onto the circuit board constructing an IC card orthe like according to the invention;

[0070]FIG. 29 is a construction diagram showing a separation conveyerpart and a mounting mechanism part in the second embodiment of the wholesystem for dicing the thin semiconductor wafer into thin semiconductorchips and mounting the semiconductor chips onto the circuit boardconstructing an IC card or the like according to the invention;

[0071]FIG. 30 is a plan view of the IC card according to the invention;

[0072]FIG. 31 is an A-B-C-D sectional view of FIG. 31;

[0073]FIG. 32 is an expanded sectional view of the principal part ofFIG. 31;

[0074]FIG. 33 is a diagram showing the step for fabricating an IC cardaccording to the invention;

[0075]FIG. 34 is a diagram explaining a step of laminating(heating/pressing) and connecting electronic component concurrently; and

[0076]FIG. 35 is a diagram explaining a step of laminating(heating/pressing) and connecting an electronic component concurrently.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0077] Embodiments of the invention will be described with reference tothe drawings.

[0078]FIG. 1 is a diagram showing a schematic construction showing afirst embodiment of a whole system for dicing (cutting) a thinsemiconductor wafer (semiconductor board) into thin semiconductor chips(semiconductor devices) and mounting the semiconductor chips onto acircuit board constructing an IC card or the like according to theinvention. The system is constructed by: a separation mechanism part(separating means) 100 for dicing (cutting) a thin semiconductor wafer(semiconductor board) 10 having the thickness of 0.002 to 0.2 mm intothin semiconductor chips (semiconductor devices) 10 having the thicknessof about 0.002 to 0.2 mm and for adsorbing a group 20 of thinsemiconductor chips (semiconductor devices) in a row state at once by avacuum collet 101; a separation conveyer part (conveying means) 200 forseparating and inverting each thin semiconductor chip from the group 20of thin semiconductor chips (semiconductor devices) in a row stateobtained by separating the thin semiconductor wafer (semiconductorboard) by the separating mechanism part 100 and for adsorbing theinverted thin semiconductor chip by a vacuum nozzle 216; and a mountingmechanism part (mounting means) 300 for positioning the thinsemiconductor chip 10 adsorbed and conveyed by the vacuum nozzle 216 inthe separation conveyer part 200 and mounting it on a circuit board 30constructing an IC card or the like. Besides to the semiconductor wafer,this system is applicable to a semiconductor devices such as a chip sizepackage and the like the plurality of which is attached together with aboard or a tape.

[0079] A method of fabricating a work 60 supplied and put on a stage 61in the separation mechanism part 100 will be described with reference toFIG. 2.

[0080] In a thin semiconductor wafer 40, semiconductor circuits areformed on a chip unit basis by a regular semiconductor fabricatingmethod on a base material such as silicon. The thin semiconductor wafer40 in which the semiconductor circuits are formed in the above manner issorted into non-defective pellets and defective pellets which can berepaired by an electric characteristics test, visual inspection, or thelike. The defective pellet is marked or the position coordinates of thedefective pellet are stored in a recording medium or a storage of aninspection system in correspondence to the item number of the thinsemiconductor wafer.

[0081] On the back face of the thin semiconductor wafer 40 inspected asmentioned above, an adhesive sheet 50 which is larger than the outershape of the semiconductor wafer 40 is adhered in a sheet adheringprocess. The adhesive sheet 50 has a sheet base material 51 formed in athin film state which is made of a resin having elasticity such as PVC(polyvinyl chloride) or PET (polyethylene terephthalate) having thediameter larger than that of the wafer. On one of the faces of the sheetbase material 51, a predetermined adhesive is applied, thereby formingan adhesive layer 52. The adhesive has the property such that theadhesive is a polyimide base material and is hardened by beingirradiated with ultra violet (UV) rays and the adhesion is weakened.

[0082] For an adhesive agent, an acrylic base material which has theproperty of hardening and weakening the adhesive strength under heat isalso applicable. As a matter of course, when using this adhesive agent,this is heated instead of being irradiated with ultra violet (UV) rays.

[0083] Subsequently, in a jig attaching process, as shown in FIG. 2A,the peripheral part of the adhesive sheet 50 to which the thinsemiconductor wafer 40 is adhered is stretched and adhered to a metallicframe (carrier ring) 55 made of stainless steel or the like while beingspread so as not to be slacked.

[0084] The thin semiconductor wafer 40 adhered onto the adhered sheet 50attached to the metallic frame (carrier ring) 55 is diced into thinsemiconductor chips by using a thin grinder 61 as shown in FIG. 2B in adicing process. The thin semiconductor wafer 40 can be diced since theadhesive sheet 50 is adhered with adhesive strength sufficient to holdat the time of dicing. Since the adhesive sheet 50 is not diced by thedicing operation, the group 20 of diced semiconductor chips are adheredto the adhesive sheet 50 by the adhesion.

[0085] As shown in FIG. 2C, the areas in which the semiconductor chips10 are adhered to the adhesive sheet 50 are irradiated with ultra violet(UV) rays and the adhesive 52 on the adhesive sheet 50 is hardened,thereby weakening the adhesive strength.

[0086] The work 60 fabricated as mentioned above is supplied to theseparation mechanism part 100 and mounted and fixed onto the movablestage 61.

[0087] The principle of the separation mechanism part 100 according tothe invention will be described with reference to FIGS. 3 to 6. FIG. 3is a front view showing a method of peeling off the group ofsemiconductor chips 10 in a row and placing them in the same positionevery row. FIG. 4 is a side view of FIG. 3. In FIG. 4, W denotes thewidth of a chip peeling roller. The width (a) of the thin semiconductorchip 10 is consequently equal to (W+2S). FIGS. 3 and 4 show a method ofpeeling off the group of semiconductor chips in a row arranged on thecoordinates x1 shown in FIG. 5 from the adhesive sheet 50 and placingthem in the same position. Consequently, x1=13+(W/2). FIG. 3 shows astate where the chip peeling roller or ball member 62 (hereinafterreferred to as a member 62) is moved from an end of the adhesive sheet50 and is positioned at (12=y1).

[0088] That is, by moving the member 62 from one end of the adhesivesheet to the other end as shown by the arrow 63 in a state where themember 62 is pushed up against the rear face of the adhesive sheet 50with a predetermined pressure so hat tension applied to the adhesivesheet 50 lies within the elastic limit, the group of thin semiconductorchips in a row is peeled from the adhesive sheet 50 and is placed in thesame position. In a state where the member 62 is in a position 13, 14from both ends of the metallic frame 55 as shown in FIG. 4 and in aposition 11, 12 from both ends of the metallic frame 55 as shown in FIG.3 for the group of thin semiconductor chips each having the dimension of(a×a), when the member 62 is pushed up with a predetermined pressure sothat the tension applied to the adhesive sheet 50 lies within theelastic limit, the adhesive sheet 50 is inclined at angles of θ1 and θ2from the horizontal face 64 (the under face of the metallic frame 55). Apeeling force f t sinθ acts on each chip 10 from the one end to theother end with the movement of the member 62. When the peeling force f tsinθ is greater than the adhesive strength F, the semiconductor chip 10is once peeled from the adhesive sheet 50 from one end toward the otherend from the state shown in FIG. 6A to the state shown in FIG. 6B, andfrom the state shown in FIG. 6B to the state shown in FIG. 6C. Asmentioned above, by linearly moving the member 62 along the group ofthin semiconductor chips in a row from one end to the other end of theadhesive sheet 50 within the metallic frame 55 in a state where themember 62 is pushed up with a predetermined pressure, all of the thinsemiconductor chips in the row are easily peeled from the adhesive sheet50 and are placed in the same position without being cracked or damaged.(ft) denotes the tension applied on the adhesive sheet 50 when themember 62 is pushed up with a predetermined pressure. The peeling angleθ has the relation of about (θ1+θ2). Reference character (R) denotes theradius of curvature of the member 62. It is sufficient to set the radius(R) of curvature within a range where the semiconductor chip is notdamaged or cracked, for example, from about 2 to 5 mm. When referencenumeral 62 is constructed by the chip peeling roller, it can berotatably supported.

[0089]FIG. 7A shows change in the tension ft applied to the adhesivesheet 50 when the back face of the adhesive sheet 50 is pushed up by themember 62 from an adhesive sheet bending face 64 of the metallic frame55 by, for instance, 3 mm. The axis of abscissa denotes the position ofthe adhesive sheet 50 adhered to the metallic frame 55. Referencecharacter A shows the center position of the adhesive sheet 50. When thelifting amount is, for example, 3 mm in the embodiment as shown in FIG.7A, the length of the adhesive sheet 50 in the case where the member 62is positioned in a peripheral part is longer than that of the case wherethe member 62 is positioned in the center position by about 0.15 mm. Thetension ft applied to the adhesive sheet 50 increases exponentially withmovement of the member 62 from the center to the peripheral part. On thecontrary, the tension ft applied to the adhesive sheet 50 decreases withmovement of the member 62 from the peripheral part to the center.

[0090]FIG. 7B shows change in the peeling angle θ=θ1+θ2 in the casewhere the back face of the adhesive sheet 50 is pushed up by the member62 by, for example, 3 mm from the adhesive sheet bonding face 64 of themetallic frame 55. The axis of abscissa denotes the position in theadhesive sheet 50 adhered to the metallic frame 55. Reference character(A) shows the center position of the adhesive sheet 50. As shown in FIG.7B, when the lifting amount is, for example, 3 mm in the embodiment, thepeeling angle θ increases exponentially with movement of the member 62from the center to the peripheral part. On the contrary, the peelingangle θ decreases with movement of the member 62 from the peripheralpart to the center.

[0091] The peeling force f t sinθ acting on the adhesive sheet 50 fromthe end for the thin semiconductor chip 10 accordingly decreases withthe movement of the member 62 from the peripheral part to the center.Naturally, the pressing force acting on the member 62 also decreaseswith the movement from the peripheral part to the center.

[0092] On the other hand, the pushing force P by the member 62 and thetension ft acting on the adhesive sheet 50 have the approximationrelation of (formula 1) shown below when the frictional resistancebetween the member 62 and the adhesive sheet 50 is ignored. When themember 62 is not rotatable but is fixed, however, the frictionalresistance between the member 62 and the adhesive sheet 50 cannot beignored, the tension ft acting on the adhesive sheet 50 increases by anamount corresponding to the frictional resistance, and the peeling forcef t sinθ naturally increases.

P=ft·(sinθ1+sinθ2)   (formula 1)

[0093] Consequently, the peeling force f t sinθ has the approximationrelation of (formula 2) shown as follows.

f t sinθ=P·sinθ1/(sinθ1+sinθ2)   (formula 2)

[0094] From the relation, by increasing the force P pushing the backface of the adhesive sheet 50 by the member 62 according to the movementof the member 62 from the peripheral part to the center within theelastic limit of the tension ft acting on the adhesive sheet 50, thepeeling force f t sinθ acting on the adhesive sheet 50 is increased soas to be greater than the adhesive strength F. Even if the thinsemiconductor chip 10 is positioned in the center part, it can be easilypeeled from the adhesive sheet 50 and positioned in the same place.

[0095] When the force P pushing the back face of the adhesive sheet 50by the member 62 is increased, the tension ft acting on the adhesivesheet 50 also increases. When the tension ft acting on the adhesivesheet 50 exceeds the elastic limit, however, the adhesive sheet 50becomes slack. The tension ft acting on the adhesive sheet 50,therefore, has to be within the elastic limit. On the other hand, sincethe adhesive sheet 50 has orientation and the elastic limit in the flowdirection (orientation direction) is larger than that in theperpendicular direction, it is necessary to set the flow (orientation)direction in the y-axis direction shown in FIG. 5 and to adhere thesemiconductor wafer 40 to the adhesive sheet 50. By the operation, theelastic limit in the y-axis direction in the adhesive sheet 50 can beincreased, the force P for pushing the back face of the adhesive sheet50 by the member 62 can be increased for the whole area, the peelingforce f t sinθ is increased, and the group of thin semiconductor chipsin a row can be easily peeled from the adhesive sheet 50.

[0096] The crack condition of the thin semiconductor chip having thethickness of about 0.002 to 0.2 mm relates to a case based on therelation of (formula 3) shown as follows where the semiconductor chip isnot peeled from the adhesive sheet 50 and bending equal to or less thanthe radius ρ of curvature is applied to the semiconductor chip.

1/ρ=M/(EI)   (formula 3)

[0097] where M is a bending moment which can be permitted to the thinsemiconductor chip, E is Young's modulus of the semiconductor chip, andI is geometrical moment of inertia by the thin semiconductor chip.

[0098] Even if the radius R of curvature of the member 62 pushing up theback face of the adhesive sheet 50 is equal to or less than the radius ρof curvature obtained from the relation of (formula 3), for example,about 2 to 5 mm, however, when the peeling force f t sinθ greater thanthe adhesive strength F is acted from one end of the semiconductor chipby the tension ft occurring in the adhesive sheet 50, the thinsemiconductor chip is peeled from the adhesive sheet without beingcracked.

[0099] A first embodiment of the separation mechanism part 100 accordingto the invention will be described with reference to FIGS. 8, 9, and 10.The work 60 is ejected from a cassette housed in a magazine (not shown)and is loaded onto the stage 61. The reason why the work is insertedinto cassette or the like and is housed in the magazine without beingexposed to the atmosphere is that, if the work 60 is left naked, asshown in FIG. 2C, the area adhered to the adhesive sheet 50 in thesemiconductor chip 10 is irradiated with ultra violet rays (UV) toharden the adhesive 52 in the adhesive sheet 50 and the adhesivestrength F is increased although it is slight. It is therefore desiredto insert the work 60 in a cassette or the like so as not to be exposedto the atmosphere or ultra violet rays so that the adhesive strength isnot increased. The adhesive strength F is maintained to be almostconstant by inserting the work 60 in the cassette or the like andhousing in the magazine or the like so that the adhesive of the adhesivesheet does not change chemically as mentioned above. Consequently, onlyby pushing the back face of the adhesive sheet 50 by the member 62, thegroup of semiconductor chips in a row state can be easily peeled off andplaced in the same position without being cracked or damaged. Whenchange in the environment (for example, the temperature) of the magazineand the separation mechanism part 100 is prevented, the characteristicsof the adhesive of the adhesive sheet after irradiation of UV are notchanged and the adhesive force F can be maintained to be almostconstant.

[0100] Reference numeral 61 is the stage on which the work 60 ejectedfrom the cassette housed in the magazine (not shown) is put and issandwiched by a fixing means 65. The stage 61 is supported by a column77 so as to be movable in the x-axis direction and is constructed to bemoved step by step at the pitch of the thin semiconductor chip row by afeeding mechanism 78 having a drive source such as a motor controlled bya controller 80 in the x-axis direction shown in FIG. 5. When the work60 is put on the stage 61, the orientation direction of the adhesivesheet 50 is set in the y-axis direction. Reference numeral 76 denotes abase; 74 a guide stage mounted on the base 76; 72 a stage forreciprocating the member 62 in the y-axis direction, which isreciprocated in the y-axis direction on the guide stage 74 by a feedingmechanism 73 connected to an output of a drive source 75 such as a motorcontrolled by the controller 80; 67 a rod member which has an end towhich the member 62 is attached and is supported so as to be movable inthe vertical direction by a supporting member 68 to be pushed up by aspring member 66; 69 a vertical moving member to which the supportingmember 68 is attached and which is moved vertically above the stage 72by a feeding mechanism 70 connected to the output of a drive source 71such as a motor controlled by the controller 80; 81 a storage forstoring a control program, control data, and the like, which isconnected to the controller 80 constructed by a computer or the like;and 82 a display means which outputs and displays the control data andthe like and is connected to the controller 80.

[0101] In the case of the first embodiment, as shown in FIG. 13A, thestage 61 is moved in response to a control command from the controller80 and the group of thin semiconductor chips in the row at the end inthe x-axis direction is positioned so as to face the line on which themember 62 is reciprocated. Coordinate information of the work 60 isinputted by using input means 83 into the controller 80. A displacementamount (position information) of the stage 61 is fed back from thefeeding mechanism 78 to the controller 80. Consequently, as mentionedabove, the stage 61 can be positioned by the control command from thecontroller 80. As shown in FIGS. 8 and 9A, the stage 72 is moved to theright end by driving the driving source 75 on the basis of the controlcommand from the controller 80 and the member 62 is positioned to theright end of the group of the thin semiconductor chips in one row at theend in the x-axis direction. After that, the supporting member 68 islifted by driving the driving source 71 by a control command from thecontroller, the back face of the adhesive sheet 50 is pushed up by themember 62 with the pressure of the spring member 66, and the tension ftis given to the adhesive sheet 50 as shown in FIG. 3. Subsequently, onthe basis of a control command from the controller 80, the stage 72 ismoved from the right end by driving the driving source 75 to the stateshown in FIG. 9B and is further moved to the left end to the state shownin FIG. 9C and FIG. 13B. Subsequently, the stage 72 is moved from theleft end to the state shown in FIG. 9D and is further moved to the rightend, thereby reciprocating the stage 72. Further, as shown in FIG. 10A,the supporting member 68 is lowered, thereby peeling off the group ofthe thin semiconductor chips in one row at the end in the x-axisdirection from the adhesive sheet 50 and placing it in the sameposition. In this case, it is unnecessary to reciprocate the stage 72.In order to certainly peel off the adhesive sheet 50, however, it ispreferable to reciprocate the stage 72. In such a state, as shown inFIG. 10B, the vacuum collet 101 is lowered by driving a drive source 102such as a cylinder by a control command from the controller 80, thegroup 20 of the thin semiconductor chips in one row is adsorbed by thevacuum collet 101 and is lifted, thereby separating the group 20 of thethin semiconductor chips in one row from the adhesive sheet 50 as shownin FIG. 10C. The vacuum collet 101 conveys the adsorbed group 20 of thethin semiconductor chips in one row to the separation conveyer part 200by a feeding mechanism 109 by driving a drive source 108 in response toa control command from the controller 80 as shown in FIG. 11A, puts thegroup 20 of the semiconductor chips on a conveyer 201 as shown in FIG.11B, and is returned to the separation mechanism part 100.

[0102] Subsequently, on the basis of the control command from thecontroller 80, the stage 61 is moved by an amount corresponding to thepitch of the group of the thin semiconductor chips of one row and themovement of the stage 72 and the supporting member 68 is controlled,thereby peeling off the group 20 of thin semiconductor chips of the nextrow from the adhesive sheet 50 by the member 62 and separating from theadhesive sheet 50 by the vacuum of the vacuum collet 101 as shown inFIG. 13C.

[0103] By repeating the above operation for the groups of the thinsemiconductor chips of all of the rows obtained by dicing thesemiconductor wafer 40, the groups of the thin semiconductor chips ofall of the rows can be peeled from the adhesive sheet 50, separated fromthe adhesive sheet 50 by the adsorbing operation of the vacuum collet101, conveyed to the separation conveyer part 200, and put on theconveyer 201.

[0104] In the first embodiment, the forces P for pushing up the adhesivesheet by the member 62 in the peripheral and central parts includingvariations in the tension of the adhesive sheet 50 are preset by theory,experiment, or the like with respect to the groups of the thinsemiconductor chips of all of the rows, and the set pushing force P isinputted by using the input means 83 or the like and is stored in thestorage 81 or the like. By inputting the conditions regarding theadhesive sheet by using the input means 83 or the like, the forces P forpushing the adhesive sheet by the member 62 in the peripheral andcentral parts can be calculated by the CPU in the controller 80 andstored in the storage 81 or the like with respect to the groups of thethin semiconductor chips in all of the rows.

[0105] By controlling the vertical movement of the supporting member 68by driving the drive source 71 on the basis of the preset pushing forcesP in the peripheral and central parts stored in the storage 81 or thelike, the controller 80 can properly set the force P for pushing theadhesive sheet by the member 62 both in the peripheral and central partswith respect to the groups of the thin semiconductor chips in all of therows in accordance with a change in flexibility (for example, acompression amount) of the spring member 66. The groups of the thinsemiconductor chips in all of the rows can be, therefore, certainlypeeled off without damaging the adhesive sheet 50.

[0106] A vacuum collet part 120 constructed by a conveying mechanismwill be described with reference to FIGS. 9, 10, and 11. Referencenumeral 109 indicates the base in which a supporting member 103 ismovably guided and supported between the separation mechanism part 100and the separation conveyer part 200. Reference numeral 108 denotes thedrive source such as a motor for moving the supporting member 103between the separation mechanism part 100 and the separation conveyerpart 200 by a feeding mechanism. On the supporting member 103, a movableblock 105 is supported so as to be movable in the vertical direction,the drive source 102 such as a cylinder is mounted, an output of thedrive source 102 is connected to the movable block 105 and the movableblock 105 is moved vertically. The movable block 105 supports the vacuumcollet 101 via a spring member 106 so as to be vertically movable. Thevacuum collet 101 is constructed in such a manner that holes forattraction are opened in accordance with the group of the semiconductorchips in a row peeled from the adhesive sheet 50 and placed, even if theholes are not closed by the semiconductor chips, the semiconductor chipsare attracted by the flow of air so as to assure the attraction by theother holes. With such a construction, even if the number of chips ofthe group of the semiconductor chips in one row is changed, theattraction is not reduced and the group of the semiconductor chips inone row can be adsorbed by the vacuum collet 101 at once. As shown inFIG. 10B, the movable block 105 and also the vacuum collet 101 aredescended by driving the drive source 102 such as a cylinder in responseto a control command from the controller 80. By contracting the springmember 106, the end of the vacuum collet 101 is allowed to contact withor come close with a small gap the group 20 of the thin semiconductorchips in one row peeled from the adhesive sheet 50 and placed and thegroup 20 of thin semiconductor chips in the row is adsorbed by thevacuum collet 101. The vacuum collet 101 is lifted with the rise of themovable block 105. In this manner, the group 20 of thin semiconductorchips in one row is separated from the adhesive sheet 50 as shown inFIG. 10C. As shown in FIG. 11A, the vacuum collet 101 which vacuums thegroup 20 of thin semiconductor chips in one row is moved together withthe supporting member 103 to the separation conveyer part 200 by thefeeding mechanism 109 by driving the drive source 108 in response to thecontrol command from the controller 80. After that, the drive source 102such as a cylinder is driven by a control command from the controller 80to descend the movable block 105 and the vacuum collet 101. The springmember 106 is compressed, the group 20 of thin semiconductor chips inone row adsorbed by the end of the vacuum collet 101 is come intocontact with the conveyer, and the vacuum of the vacuum collet 101 iscanceled, thereby enabling the group 20 of thin semiconductor chips inone row to be put on the conveyer 201 as shown in FIG. 11B.

[0107] A second embodiment in which the vacuum collet 101 in theseparation mechanism part 100 according to the invention is removed willbe described. A point different from the first embodiment is such thatthe forces P for pushing up the adhesive sheet by the member 62 in bothof the peripheral and central portions are controlled more accuratelywith respect to the groups of thin semiconductor chips in all of rows.

[0108] Reference numeral 84 denotes a pressure sensor attached to thesupporting member 68, which optically or magnetically senses adisplacement of the member 62, thereby sensing the pressure P forpushing up the adhesive sheet 50 by the member 62 via the spring member66. The pressure sensor 84 can be constructed by a distortion gauge orthe like and provided between the spring member 66 and the supportingmember 68 so as to sense the pressure P for pushing up the adhesivesheet 50 by the member 62 via the spring member 66. It is also possibleto construct in such a manner that the spring member 66 is removed fromthe member 62 and the pressure sensor 84 is directly attached to thelower end of the member 62 so as to sense the pressure P. Referencenumeral 85 denotes a displacement sensor attached on the stage 72, whichoptically or magnetically senses displacement of the member 62, therebysensing flexibility (h) of the adhesive sheet 50. The reason why theflexibility (h) of the adhesive sheet 50 can be sensed by thedisplacement sensor 85 is because there is no fluctuation in distancebetween the stage 61 on which the work 60 is put and the stage 72. Whenthe end of the member 62 is come into contact with the under face of theadhesive sheet 50 preliminarily attached to the metallic frame 55, thedisplacement sensor 85 senses it and the sensed position can be used asa reference position where there is no flexibility in the adhesive sheet50. The displacement sensor 85 can be constructed by an air micro whichis attached to the tip of the stage 72 and directly measures theflexibility near the back face of the adhesive sheet 50 to which the tipof the member 62 acts.

[0109] As mentioned above, when the member 62 is lifted by driving thedrive source 72 with the pressure P for pushing up the adhesive sheet 50by the member 62 sensed by the pressure sensor 84 and the flexibility(h) of the adhesive sheet 50 sensed by the displacement sensor 85,thereby pushing up the back face of the adhesive sheet 50, it can becontrolled so that the tension ft applied on the adhesive sheet 50 doesnot exceed the elastic limit and the separation force f t sin θ exceedsthe adhesive strength F in the whole area of the adhesive sheet 50. As aresult, only by pushing up the member 62 against the back face of theadhesive sheet 50 and moving the member 62 in the y-axis direction, thegroup of thin semiconductor chips in a row can be easily peeled off andplaced in the same position without being cracked or damaged. In case ofthe embodiment, when the back face of the adhesive sheet 50 is pushed upby lifting the member 62 by driving the drive source 71, even if thetension ft applied on the adhesive sheet 50 exceeds the elastic limitand the adhesive sheet 50 is slightly slackened, the force P for pushingup the back face of the adhesive sheet 50 by the member 62 can becontrolled in accordance with the slack of the adhesive sheet.Consequently, the group of thin semiconductor chips in one row can beeasily peeled from the adhesive sheet 50 by applying a desired tensionto the adhesive sheet 50 without being cracked or damaged.

[0110] The controller 80 can obtain the information (11, 12) that thestage 72 is displaced in the y-axis direction and the member 62 ispositioned in the y-axis direction from a displacement sensor such asencoder provided for the drive source 75. The controller 80 can alsoobtain the information (13+W/2, 14+W/2) that the stage 61 is displacedin the x-axis direction and the member 62 is positioned in the x-axisdirection from a displacement sensor such as an encoder provided for thedrive source 78.

[0111] From the above, the controller 80 can calculate the angles θ1 andθ2 between the adhesive sheet 50 and the under face 64 of the metallicframe 55 shown in FIG. 3 from the positional information (11, 12) in they-axis direction of the member 62 obtained from the displacement sensorsuch as an encoder provided for the drive source 75 and the flexibility(h) of the adhesive sheet 50 sensed by the displacement sensor 85.Further, since the pressure P for pushing up the adhesive sheet 50 bythe member 62 can be sensed by the pressure sensor 84, the tension ftacting on the adhesive sheet 50 can be calculated from (formula 1).

[0112] Thus, the controller 80 controls the drive source 71 so that thetension ft applied on the adhesive sheet 50 is within the elastic limitand the peeling force f t sinθ sufficiently exceeds the adhesivestrength F in the whole area of the adhesive sheet 50, only by pushingup the back face of the adhesive sheet 50 by the member 62 and movingthe member 62 in the y-axis direction, the group of thin semiconductorchips in a row can be easily peeled off and placed in the same placewithout cracking or damaging them.

[0113] The spring member 66 in the second embodiment as mentioned abovecan also play a role to soften the impact when the tension is applied tothe adhesive sheet 50 by pushing up the member 62. The stages 61 and 72are controlled in a manner similar to the first embodiment as shown inFIG. 13.

[0114] That is, as shown in FIG. 8, the stage 72 is moved to the rightend by driving the drive source 75 on the basis of the control commandfrom the controller 80, thereby positioning the member 62 to the rightend of the group of thin semiconductor chips in one row at the end inthe x-axis direction. After that, by the control command from thecontroller 80, the supporting member 68 is lifted by driving the drivesource 71 and the back face of the adhesive sheet 50 is pushed up by themember 62 with the pressure of the spring member 66, thereby applyingthe tension ft to the adhesive sheet 50 as shown in FIG. 3.Subsequently, on the basis of the control command from the controller80, the drive source 75 is driven to reciprocate the stage 72 by movingfrom the right end to the left end as shown in FIG. 13B and subsequentlyfrom the left end to the right end. Consequently, the group of thinsemiconductor chips in one row at the end in the x-axis direction ispeeled from the adhesive sheet 50 and placed in the same position. Insuch a state, the vacuum collet 101 descends as shown in FIG. 10B,vacuums the group 20 of thin semiconductor chips in one row and islifted as shown in FIG. 10C, thereby separating the group 20 of thinsemiconductor chips in one row from the adhesive sheet 50. As shown inFIGS. 11A and B, the vacuum collet 101 conveys the adsorbed group 20 ofthin semiconductor chips in one row to the separation conveyer part 200and puts them on the conveyer 201, and is returned to the separationmechanism part 100.

[0115] Subsequently, on the basis of the control command from thecontroller 80, the stage 61 is moved by an amount corresponding to thepitch of the group of thin semiconductor chips in one row, the movementof the stage 72 and the supporting member 68 is controlled, and thegroup 20 of thin semiconductor chips in the next row is peeled from theadhesive sheet 50 by the member 62 as shown in FIG. 13C and is separatedfrom the adhesive sheet 50 by the adsorbing operation of the vacuumcollet 101.

[0116] By repeating the above operation with respect to the groups ofthin semiconductor chips in all of the rows obtained by dicing thesemiconductor wafer 40, the groups of thin semiconductor chips in all ofthe rows are peeled from the adhesive sheet 50 in serial order,separated from the adhesive sheet 50 by the adsorbing operation of thevacuum collet 101, conveyed to the separation conveyer part 200, andplaced on the conveyer 201.

[0117] A third embodiment in which the vacuum collet 101 is removed fromthe separation mechanism part 100 according to the invention will bedescribed with reference to FIG. 14. According to the third embodiment,the adhesive sheet 50 is adhered to the metallic frame 55 and, afterthat, the semiconductor wafer 40 is diced into the semiconductor chips10, and variations in the tension of the adhesive sheet 50 adhered tothe metallic frame 55 occurring until the work 60 in which the adhesionof the semiconductor chips 10 to the adhesive sheet 50 is weakened bythe UV irradiation is loaded onto the stage 61 are suppressed. Referencenumeral 91 denotes a ring-shaped groove formed in the stage 61 along theinner periphery of the metallic frame 55 of the adhesive sheet 50adhered to the metallic frame 55; 92 a ring-shaped pressing member usinga pressure of a spring member 93; 95 a shaft having a stopper formed atthe upper end of the ring-shaped pressing member 92; 94 a supportingmember for supporting the ring-shaped pressing member 92 so as to bemovable in the vertical direction and for supporting the shaft 95 so asto be vertically slidable; and 96 a cylinder attached to the stage 61 byan attaching member 97, which connects an output to the supportingmember 94 and allows the ring-shaped pressing member 92 to escape upwardso as to set the work 60 onto the stage 61.

[0118] With the construction, the back face of the outer peripheral partof the adhesive sheet 50 adhered to the metallic frame 55 in the work 60put on the stage is supported by both ends of the ring-shaped groove 91.The ring-shaped pressing member 92 is pressed from the surface side ofthe peripheral part of the adhesive sheet 50 with the pressure given bythe spring member 93 and the adhesive sheet 50 is stretched toward theinside of the groove 91, thereby enabling a predetermined tension to begiven to the adhesive sheet 50. The spring member 93 with littlecompressing fluctuation by the displacement is required to be used. Apart supporting the back face of the adhesive sheet 50 formed in thering-shaped groove 91 is required to be formed in a circular shape incross section so as to reduce the frictional resistance. If thefrictional resistance is not reduced only by forming the part supportingthe back face of the adhesive sheet 50 formed in the ring-shaped groove91 in a circular shape in cross section, it is desired to cover thesurface with a material having a little frictional resistance.

[0119] As mentioned above, according to the third embodiment, even ifthere is variation in tension of the adhesive sheet 50 adhered to themetallic frame 55 in the state of the work 60, only by placing the work60 on the stage 61, the ring-shaped pressing member 92 is descendedtogether with the supporting member 94 by the cylinder 96 in response tothe drive command from the controller 80, the ring-shaped pressingmember 92 is pressed by the pressure given the spring member 93, and theadhesive sheet 50 is stretched into the groove 91, thereby enabling apredetermined tension to be given to the adhesive sheet 50.

[0120] Consequently, as described in the first embodiment, the drivesource 71 is driven in response to the drive command from the controller80, the supporting member 68 is raised by a desired displacement amount,and the back face of the adhesive sheet 50 is pushed up by the member 62with the pressure given the spring member 66 by a desired displacementamount (h), thereby enabling the tension ft to be given to the adhesivesheet 50 without detecting the pressing force P as shown in FIG. 3.

[0121] Finally, when the work having only the adhesive sheet from whichall of the semiconductor chips are taken out is detached from the stage61, it is necessary to lift and escape the ring-shaped pressing member92 together with the supporting member 94 by the cylinder 96 on thebasis of the drive command from the controller 80.

[0122] A fourth embodiment of the separation mechanism part 100according to the invention will be described with reference to FIG. 15.The fourth embodiment is different from the first, second, and thirdembodiments with respect to the following point. By lifting a block 110on which needles 112 are vertically provided in accordance with thegroup 20 of semiconductor chips in one row, the group 20 ofsemiconductor chips in one row peeled from the adhesive sheet 50 andplaced in the same position in the first and second embodiments areseparated from the adhesive sheet 50 by lifting the group 20 ofsemiconductor chips in only one row by the tips of the needles 112 viathe adhesive sheet 50 from a state shown in FIG. 15B to a state shown inFIG. 15C and is allowed to contact with the vacuum collet 101 whichfaces from the above and is adsorbed by the vacuum collet 101. That is,the block 110 on which the needles 112 are vertically formed inaccordance with the group 20 of semiconductor chips in one row issupported so as to be movable in the vertical direction on the stage 74.The block 110 is connected to the output of a drive source 111 mountedon the stage 74 and the drive source 111 is driven on the basis of thecontrol command from the controller 80, thereby enabling the block 110to be moved vertically. Consequently, as shown in FIG. 15A, in a mannersimilar to the first and second embodiments, by reciprocating the member62 in the y-axis direction in a state where the member 62 is lifted topush up the adhesive sheet 50 in the work 60, the group 20 ofsemiconductor chips in one row is peeled from the adhesive sheet 50 andis placed in the same position. After that, by driving the drive source111 on the basis of the control command from the controller 80, theblock 110 is lifted. The group 20 of semiconductor chips in one rowpeeled by the needles 112 vertically formed on the block 110 is slightlylifted and separated from the adhesive sheet 50. The movable block 105is descended by driving the drive source 102 such as a cylinder by thecontrol command from the controller 80 and the vacuum collet 101 is alsodescended. The spring member 106 is contracted to make the end of thevacuum collet 101 come into contact with the group 20 of thinsemiconductor chips in one row slightly apart from the adhesive sheet 50and the group 20 of thin semiconductor chips in one row is adsorbed bythe vacuum collet 101. By lifting the vacuum collet 101 with the rise ofthe movable block 105, a state shown in FIG. 15D is obtained. Theoperation after that is similar to that in the first embodiment as shownin FIGS. 11A and B.

[0123] According to the fourth embodiment, the group 20 of thinsemiconductor chips in one row peeled from the adhesive sheet 50 andplaced in the same position is further slightly lifted up by the needles112. Consequently, even if there is a semiconductor chip which is notpeeled from the adhesive sheet 50 by chance, it can be certainly peeledfrom the adhesive sheet 50 and adsorbed and lifted up by the vacuumcollet 101. Since a separation force acts on a semiconductor chip whichis not sill peeled from the adhesive sheet 50 even after adsorbed andlifted by the vacuum collet 101, the fourth embodiment can besufficiently practically used also in the first and second embodiments.

[0124] A specific construction of a first embodiment of a whole systemfor dicing (cutting) a thin semiconductor wafer (semiconductorsubstrate) into thin semiconductor chips (semiconductor devices) andmounting the semiconductor chips onto a circuit board constructing an ICcard or the like according to the invention will be described withreference to FIG. 16. Since the separation mechanism part 100 has beenalready described, the description is omitted here. The separationconveyer part 200 comprises the conveyer 201, a sensor 202, a sensor203, a rotating member 208 with a nozzle, an image pickup means 209, anda conveying mechanism 230. The conveyer 201 is provided on a base 218and conveys the group 20 of thin semiconductor chips (semiconductordevices) in a row which is to be conveyed and put by the vacuum collet101 in the separation mechanism part 100. The sensor 202 senses a markeddefective chip conveyed by the conveyer 201 and senses that a space inwhich the group 20 of thin semiconductor chips (semiconductor devices)is carried by the conveyer 201 and put by the vacuum collet 101 can beassured. The sensor 203 senses that the semiconductor chip conveyed bythe conveyer 201 has come to the separation position. The rotatingmember 208 with a nozzle has: a discharging means constructed by a chute206 and a housing container 207 to eject the defective semiconductorchip when the sensor 203 senses that the defective semiconductor chipsensed by the sensor 202 has come to the separation position; and anozzle for attracting and inverting the non-defective semiconductorchips sensed by the sensor 203 and which is indexed by a drive source220. The image pickup means 209 is provided for the rotating member 208and measures the outer shape of the semiconductor chip 10 adsorbed bythe nozzle which is expanded and contracted. The conveying mechanism 230vacuums the semiconductor chips 10 adsorbed by the nozzle 216 expandingand contracted by a drive means such as a cam mechanism provided for therotating member 208 and inverted by the index of the rotating member 208and conveys the semiconductor chips 10 to the mounting mechanism part300. The conveying mechanism 230 has a moving unit 210 which moves alonga guide 212, a drive source 211 for moving the moving unit 210 via afeeding mechanism 213, and a block 215 with a vacuum nozzle to which thevacuum nozzle 216 is attached supported on the moving unit 210 so as tobe movable in the vertical direction by a drive source 214 such as acylinder. The sensors 202, 203, image pick means 209, drive source 217for driving the conveyer 201, index drive source 220 of the rotatingmember 208, and drive sources 211 and 214 of the conveying mechanism 230are connected to the controller 80. The controller 80 drives the variousdrive sources 217, 220, 211, and 214 in accordance with informationobtained from the sensors 202, 203, the image pickup means 209, and thelike.

[0125] When it is sensed by the sensor 202 that the space for the group20 of semiconductor chips is assured, therefore, the group 20 ofsemiconductor chips is conveyed from the separation mechanism part 100and is put on the conveyer 201 by the vacuum collet 101. The markeddefective semiconductor chip is detected by the sensor 202. When each ofthe semiconductor chips conveyed by the conveyer 201 and has come to theseparation position is sensed by the sensor 203, the nozzle provided forthe rotating member 208 to be indexed is extended and descended andvacuums the semiconductor chip which has come to the separationposition. The outer shape of the semiconductor chip adsorbed by thenozzle when the rotating member 208 is indexed is measured by the imagepickup means 209 and the information is inputted to the controller 80.Actually, the image pickup means 209 obtains an image of the side onwhich an electrode 11 is not formed of the semiconductor chip, so thatinformation of only the outer shape is obtained. The semiconductor chip10 is adsorbed by the vacuum nozzle 216 on the basis of the information.That is, as shown in FIGS. 18C and D, positional information (δx, δy)for the vacuum nozzle 216 shown by a chain line in FIG. 18D in thesemiconductor chip 10 adsorbed by the vacuum nozzle 216 shown by a solidline is obtained from the information of only the outer shape measuredby the image pickup means 209 and is inputted to the controller 80.

[0126] Further, the chip adsorbed by the nozzle of the rotating member208 and inverted by the index of the rotating member 208 is adsorbed bythe vacuum nozzle 216 in the conveying mechanism 230 and is carried tothe mounting mechanism part 300.

[0127] In the mounting mechanism part 300, only by descending the vacuumnozzle 216, the semiconductor chip adsorbed by the vacuum nozzle 216 andconveyed by the conveying mechanism 230 is put on X-Y stages 302 and 303and can be mounted on the circuit board 30 constructing an IC card orthe like positioned by the X-Y stages 302 and 303. Especially, in caseof mounting the semiconductor chip on the circuit board 30, it isnecessary to position and mount the electrode 11 formed on thesemiconductor chip and the electrode formed on the circuit board 30. Animage pickup means 306 is installed in a passage through which thesemiconductor chip adsorbed by the vacuum nozzle 216 is conveyed by theconveying mechanism 230, picks up the image of the side on which theelectrode 11 is formed in the semiconductor chip, measures the positions(d1x, d1y) (d2x, d2y) of the electrode (pad) 11 by using the outer shapeas a reference, and inputs the data into the controller 80. Thesemiconductor chip 10 is conveyed by a determined distance to themounting mechanism part 300 by the conveying mechanism 230 by using thevacuum nozzle 216 as a reference. On the other hand, in the mountingmechanism part 300, the position information of each electrode 11 formedon the semiconductor chip using the vacuum nozzle 216 as a reference isnecessary. The position information of each electrode 11 can becalculated on the basis of the position information (d1x, d1y) (d2x,d2y) of each electrode (pad) 11 obtained by using the outer shape pickedup the by the pickup means 306 as a reference and outer shape positioninformation (δx, δy) picked up by the image pickup means 209 andobtained by using the vacuum nozzle as a reference. The positioninformation of the electrode 11 preliminarily formed on thesemiconductor chip and the electrode formed on the circuit board to beconnected is inputted to the controller 80 and is stored into, forexample, the storage 81. When the semiconductor chip is mounted on thecircuit board 30, the controller 80 positions the X-Y stages 302 and 303by driving drive sources 304 and 305 which drive the X-Y stages 302 and303 on the basis of the position information of the electrode formed onthe circuit board and the calculated position information of eachelectrode 11 formed on the semiconductor chip obtained by using thevacuum nozzle 216 as a reference, thereby enabling the electrode formedon the circuit board and the electrode formed on the semiconductor chipto be connected by using a bonding material or the like.

[0128] Although the case where the defective semiconductor chip issensed by the sensor 202 in the separation conveyer part 200 has beendescribed, since the position information in the semiconductor wafercoordinates (shown in FIG. 17C) of the defective semiconductor chip hasbeen sensed by the test as shown in FIGS. 17A and B, if the positioninformation is inputted to the controller 80, the defectivesemiconductor chip can be removed in the separation position by theejecting means 207, 207.

[0129] Although the case where the separation mechanism part 100 isarranged in the vertical direction has been described in the embodiment,a plurality of the separation mechanism part 100 can be arranged also inthe lateral direction. In this case, it is necessary to add a mechanismwhich can change operation for conveying the vacuum collet 101 in thevacuum collet part 120 constructed by a conveying mechanism from thevertical direction to the lateral direction. When the separationmechanism part 100 is arranged laterally, the conveying operation of thevacuum collet 101 shown by 103 in FIG. 1 to the separation conveyer part200 has to be performed in both of the vertical and lateral directions.By arranging the separation mechanism part 100 laterally, however, aplurality of separation mechanism parts 100 can be arranged side byside. Consequently, the group 20 of semiconductor chips in rows can besupplied more to the separation conveyer part 200.

[0130] A second embodiment of the whole system for dicing (cutting) athin semiconductor wafer (semiconductor substrate) into thinsemiconductor chips (semiconductor devices) and mounting thesemiconductor chips onto a circuit board constructing an IC card or thelike according to the invention will be described with reference toFIGS. 19 to 29. A part largely different from the first embodiment is aseparation mechanism part 100′. The operation of the separationmechanism part (separation means) 100′ will be described with referenceto FIG. 19. As shown in FIG. 19A, the whole surface on which theelectrode 11 is formed of the semiconductor chip obtained by the dicingoperation is strongly held by a chuck 150 for the work 60. The chuck 150has a chuck face member 151 in which grooves 152 for vacuum adsorptionare formed on the surface in correspondence to the semiconductor chips10 and the grooves 152 are communicated with a vacuum source 153. It isnot always necessary to construct the chuck 150 by a vacuum chuck. Anymember can be used as long as the semiconductor chips can be stronglyheld. It can be also constructed by a magnet chuck or a frozen chuck (bya deep-freezing process which deep-freezes water on the surface of thechuck, the group of the semiconductor chips is fixed and it is removableby an unfreezing process). The adhesive sheet near the inner peripheryof the metallic frame 55 for the work 60 which is strongly held by thechuck 150 is diced by rotating a cutter 155 and the metallic frame 55 iscut off from the adhesive sheet 50.

[0131] As shown in FIG. 19B, the chuck 150 and a clamp means 160constructed by a pair of clamp rollers are made relatively close to eachother and one end of the adhesive sheet 50 from which the metallic frame55 is cut is clamped by the clamp means 160 made of the pair of clamprollers.

[0132] Subsequently, while relatively moving the chuck 150 and the clampmeans 160, the whole clamp means 160 is turned by 180° around an axis161 as a center as shown by the arrow 162. As shown in FIG. 19C, the endof the adhesive sheet 50 is lifted upward.

[0133] By further relatively moving the chuck 150 and the clamp means160, as shown in FIG. 19D, the adhesive sheet 50 adhered with theadhesive strength which is remarkably deteriorated by the UV irradiationto the group of the thin semiconductor chips is pulled laterally and ispeeled from the group of thin semiconductor chips held by the chuck 150without cracking the group of thin semiconductor chips. In thisembodiment as well, as the adhesive sheet is peeled from the group ofthe thin semiconductor chips by the pulling force acting on the adhesivesheet, the adhesive sheet is peeled from one end of the semiconductorchip to the other end. Consequently, the adhesive sheet 50 can be peeledoff without cracking and damaging any of the thin semiconductor chipsheld by the chuck 50. Further, when the direction of peeling the thinsemiconductor chips 10 from the adhesive sheet 50 is set from the cornerof the semiconductor chip, the adhesive sheet 50 can be peeled withweaker force.

[0134] That is, in the second embodiment, when the adhesive sheet 50 ispeeled from the group of thin semiconductor chips 10 by the pullingforce F which acts on the adhesive sheet 50, the relation of an angleψof the acting direction of the pulling force F against the surface ofthe semiconductor chips and the forces Fx and Fy is shown in FIG. 20.Since the pulling force Fx is in the approximate relation to Fx=F cos ψ,a bigger pulling force will be obtained if ψ is smaller and consequentlypeeling the adhesive sheet 50 from the group of thin semiconductor chips10 becomes easier. On the other hand, the force F which is against theholding force of the semiconductor chips 10 to the chuck 150 will besmaller if ψ becomes smaller. So the chuck 150 needs not have a very bigholding force of and it is possible to decrease the possibility to crackthe thin semiconductor chips 10.

[0135] Thus, in order to have and assure an angleψ of acting directionof the pulling force F as small as possible, a wedge-shaped peelingangle fixing jig 165 is used as shown in FIGS. 21 A and B. Thewedge-shaped peeling angle fixing jig 165 has roles of assuring thepeeling angleψ and focusing the peeling force by justifying a peelinglocation linearly against the group of the diced thin semiconductorchips. A top end 165 a of the wedge-shaped peeling angle fixing jig 165,as shown in FIG. 23A, prevents the semiconductor chips 10 from crackingby avoiding the peeling force focusing at one point and forming thepredetermined curved face (approximately 0.5 to 2.0 mm in radius). Withthe smaller radius of the curved face, it is easy to peel since thepeeling force is focused. As a matter of course, with the thinneradhesive sheet, the smaller is the radius of the curved face, thus thepeeling force is focused.

[0136] Subsequently, the separation mechanism part 100′ (separatingmeans) using the wedge-shaped peeling angle fixing jig 165 will beexplained with reference to FIG. 22. Fundamentally, FIGS. 22A and B isthe same to FIGS. 19A and B. As shown in FIG. 22B, the peeling anglefixing jig 165 is located in the right end to be close to the surface ofthe adhesive sheet 50. While relatively moving the chuck 150 and theclamp means 160, the whole clamp means is turned about an axis 161 by180° as shown by the arrow 162. As shown in FIG. 22C, the end of theadhesive sheet 50 is lifted upward and bent at the top end 165 a of thepeeling angle fixing jig. By giving the pulling force F to an adhesivetape 50 with the clamp means 160, and focusing the peeling force of theadhesive tape at the curved surface formed at the top end 165 a of thepeeling angle fixing jig 165 while moving the whole clamp means 160 atthe approximately double moving speed of the peeling angle fixing jig,the adhesive sheet 50 is peeled in serial order from each end of thesemiconductor chips 10. Thus, by connecting the output force of thetorque motor to one of the rollers of the clamp means 160 and giving adesired rotation torque, the pulling force F is given to the adhesivesheet 50. Therefore, a moving speed of the whole clamp means 160 may beapproximately double the speed of peeling angle fixing jig 165.

[0137] As explained above, by using the peeling angle fixing jig 165, itis possible to assure the peeling angle ψ, to justify a peeling locationlinearly against the group of the diced thin semiconductor chips, tofocus the peeling force, and to peel the adhesive sheet 50 smoothlywithout cracking each thin semiconductor chip.

[0138] Though the embodiment utilizing the peeling angle fixing jig 165is mentioned, without using the jig 165 as shown in FIG. 23B, obviouslyit is possible to use a method for peeling while forming a bending shapeof the bending part only by changing the height between the clamp means160 and the adhesive sheet with the use of bending force of the adhesivesheet.

[0139] As for the directions of peeling the adhesive sheet 50 againstthe group of the diced semiconductor chips, there are the direction inwhich the semiconductor chips are arranged as shown in FIG. 21A, and thedirection in which the plane surface tilts against the direction ofsemiconductor chips arranged as shown in FIG. 21B. Since in the caseshown in FIG. 21B, the adhesive sheet begins to be peeled from thecorner against each conductor chip, it is supposed that it is easier tobe peeled than the case shown in FIG. 21A.

[0140] In the chuck 150, as shown in FIGS. 21A and B, if a porousabsorptive plate 153 is provided on the absorptive surface, there is noneed to fill absorptive holes except those for the group of thesemiconductor chips and to adjust an arrangement of absorptive holes forthe semiconductor chips. However, if the porous absorptive plate 153 isused, the absorptive force will be lowered.

[0141] In the chuck 150, as shown in FIG. 24, by applying a fluorineresin film on the adsorptive surface provided a plurality ofpinhole-shaped adsorptive holes, it is possible not to damage a circuitsurface since the adsorptive force can be assured as well as the circuitsurface formed electrodes or the like of the semiconductor chips isadsorbed by assuring the holding force to some extent. However, asurface of the fluorine resin film bears the electrical charge, at timesit is neutralized by ion blowing using an ion ejection means 166 andthus gives no influence to the semiconductor chips.

[0142] As shown in FIG. 25, by pressing a row of the semiconductor chipsfrom which the adhesive sheet 50 is being peeled following right afterthe top end 165 a of the peeling angle fixing jig 165, it is possible tohold the group of the semiconductor chips from which the adhesive sheet50 is peeled to the chuck 150 even if the adhesive force of the chuck150 is weak. In this case, as the pressing means, a long roller rollingahead of the pressing mechanism can be attached to follow right afterthe top end 165 a of the peeling angle fixing jig 165.

[0143] As shown enlarged in FIG. 26D, by lightly pressing the part ofthe adhesive 50 peeled from the semiconductor chips with a rotatableroller 168, it is possible to form the bending part at a predeterminedcurved surface as same as to the top end 165 a of the peeling anglefixing jig 165, to decrease the angleψ of the direction in which thepulling force F acts, and increase the peeling force of the adhesivesheet from the semiconductor chips.

[0144] And as shown in FIG. 23C, by controlling a relation between theposition of the roller 168, since this case is only for decreasing theangleψ, the pressing of the rotatable roller 168—and the bending part ofthe adhesive sheet, and changing the pressing amount of the roller 168,it is obvious that the bending shape of the peeled part of the adhesivetape can be changed. However, in this case it is only for decreasing theangleψ, it is needed to press lightly with the rotatable roller 168. Inaddition, it is necessary that a moving speed of the whole clamp means160 becomes double the speed of rotatable roller 168.

[0145] As shown in FIG. 27B, since the number of semiconductor chipsadhered to the adhesive sheet are decreasing when approaching a finishof peeling the adhesive sheet for the semiconductor chips held at thechuck 150, a big force to horizontally move the semiconductor chips heldat the chuck 150 works as the reaction of the peeling force Fx and theadhesive sheet may not be able to be peeled from a few semiconductorchips. Even if the adhesive sheet is peeled, because of the slippage onthe adsorptive surface of the semiconductor chips, the semiconductorchips cannot be picked up or it may touch and crack the peeled chips.Consequently, as shown in FIGS. 27A, C or D, it is necessary to fix theperiphery of the adhesive sheet 50 to that of the periphery (frame) ofthe chuck 150.

[0146] Consequently, a vacuum adsorptive hole 156 is provided in theperiphery (frame) of the chuck 150 and a needle spicule 157 is providedin the periphery (frame) of the chuck 150. And in a state shown in FIGS.22B, 25B, and 26B, by pushing the periphery part of the adhesive sheetagainst the periphery (frame) 159 of the chuck 150 with a pushing upmember 169, the adhesive sheet is fixed and bites into the needlespicule 157. And as shown in FIGS. 27C and D, by providing the vacuumadsorptive hole outside the frame of the chuck 150 too, pressing theperiphery of the adhesive sheet with the pushing up member slippedoutward, and additionally pressing from the side in order to be adsorbedto the vacuum adsorptive hole 158, the periphery of the adhesive sheet50 can be firmly fixed to the periphery (frame) 159 of the chuck 150. Incase when the adhesive sheet can be fixed by the vacuum adsorption, theneedle spicle is not needed.

[0147] The separation mechanism part (separating means) 100′ isconstructed as specifically shown in FIG. 28. The work 60 is suppliedonto the supporting member 170 with the side of the adhesive sheet 50facing upward and the metallic frame 55 is positioned and fixed.

[0148] The chuck 150 is attached onto the supporting member 171 which iselevated by the drive source 173. The supporting member 171 is supportedmovably in the vertical direction by a stage 172 which is supported soas to be movable in the lateral direction on a base 175 by feedingoperation of a drive source 174.

[0149] Consequently, by elevating the chuck 150 to give the chuck force,the chuck 150 strongly holds the whole surface on which the electrode 11of the semiconductor chip is formed of the work 60 fixed by thesupporting member 171. By driving a drive source 182, a supportingmember 179 which supports a rotating member 178 to which the cutter 155is attached is descended. By rotating the rotating member 178 by drivinga drive source 180, the metallic frame 55 is diced from the adhesivesheet 50. Reference numeral 181 denotes a member for supporting thesupporting member 179 movably in the vertical direction.

[0150] The cutter 155 is lifted and the chuck 150 is simultaneouslydescended by driving the drive source 173 and is moved laterally to theclamp means 160 constructed by the pair of clamps which wait for thechuck 150 by driving the drive source 174. The clamp means 160 comprisesa moving mechanism having a drive source for moving the clamp means 160laterally and a rotating means having a drive source for turning theclamp means 160 by 180°.

[0151] As mentioned above, one end of the adhesive sheet 50 is clampedby the clamp means 160, the adhesive sheet 50 is peeled from the groupof thin semiconductor chips held by the chuck 150 by a relativeoperation of the chuck 150 and the clamp means 160, the peeled adhesivesheet is adsorbed by the vacuum means 176 and is removed.

[0152] The chuck force of the chuck 150 to the group of thinsemiconductor chips is weakened, the face opposite to the electrode faceis adsorbed by the vacuum collet 101 every group of semiconductor chipsof one row and the group of semiconductor chips is put on the conveyer201 with the electrode face facing downward. In the case of theembodiment as shown in FIG. 29, since the group 20 of thin semiconductorchips is put on the conveyer 201 with the electrode face facing downwardin a separation conveyer part (conveying means) 200′, the invertingmechanism 208 shown in FIGS. 1 and 16 is unnecessary. Reference numeral250 is a transfer mechanism for transferring the non-defectivesemiconductor chips conveyed by the conveyer 201 to the conveyer 251 andaligning the semiconductor chips on the conveyer 251. The mountingmechanism part (mounting means) 300 is similar to that in the firstembodiment.

[0153] Also in the second embodiment as described above, in a mannersimilar to the first embodiment, the thin semiconductor wafer is dicedinto thin semiconductor chips and the thin semiconductor chips can bemounted onto the circuit board which is used to form an IC card or thelike at high speed while shortening tact time without cracking ordamaging the thin semiconductor chips.

[0154] Although in a second embodiment the case in which the separationmechanism 100′ arranged in lengthwise is explained, it is required toadd a mechanism which can change a direction of the movement from thelengthwise direction to the lateral direction of conveying the vacuumcollet 101 in the vacuum collet part 120 comprising the conveyermechanism as same as in a first embodiment. Thus, in case of theseparation mechanism arranged in the lateral direction, the conveyingmovement shown by a reference numeral 130 of the vacuum collet 101 tothe separation conveyer part 200 shown in FIG. 1 needs the lengthwiseand the lateral directions. However, the separation mechanism part 100′arranged laterally allows a plurality of the separation mechanism part100′ to be provided in line, and thus it is possible to provide moregroups of the semiconductor chips peeled from the adhesive sheet 50 tothe separation conveyer part 200′.

[0155] In the first and the second embodiments mentioned above,explained is the case of dicing a thin semiconductor wafer in a statewhere it is adhered to an adhesive sheet into thin semiconductor devices(semiconductor chips), peeling the group of the diced thin semiconductordevices from the adhesive sheet, conveying the group of peeledsemiconductor devices in a predetermined unit in serial order, andmounting each semiconductor device to a mounting board (circuit board).However, it is possible to apply in the case of cutting semiconductordevices (electronic components) like a chip size package which are manyin row attached with a board or a tape in a state where it is adhered toan adhesive sheet into the semiconductor devices (electronic components)on a unit basis instead of a thin semiconductor wafer, peeling the groupof diced semiconductor devices from the adhesive sheet, conveying thegroup of the peeled semiconductor devices in serial order in apredetermined unit, and mounting each semiconductor device to themounting board (circuit board). That is, there are various modes as thestate of adhering to the adhesive sheet.

[0156] Thus, by cutting electronic components in row attached with aboard or a tape on a unit basis in a state where they are adhered to anadhesive sheet, peeling the group of cut electronic components from theadhesive sheet by one operation in a state where a mounting surface ofthe group of the cut electronic components is held by the chuck, it ispossible to provide the electronic component to a mounting position athigh speed without reversing the electronic component.

[0157] The following is the explanation of an embodiment of a method forconstructing and fabricating an IC card which is a thin electroniccircuit component mounting the above mentioned semiconductor chips tothe circuit board.

[0158] Firstly, a structure of an IC card is explained with reference toFIGS. 30 to 32. FIG. 30 is a plan view of an IC card. FIG. 31 is anA-B-C-D cross sectional view of FIG. 30. FIG. 32 is an enlarged crosssectional view of a principal part of FIG. 31.

[0159] As shown in FIG. 30, an IC card 400 comprises a film 410, aconductor pattern 420 formed on and a film 410, and an electroniccomponent 430 such as an IC chip connected to the conductor pattern 420via an access terminal. A part of the conductor pattern 420 constitutesa loop-shaped antenna coil 422 which is connected to the electroniccomponent 430 (10) by the conductor pattern. The number of winding turnsof the loop-shaped antenna is optional. The electronic component 430 isfixed with a temporary fixing fluid 440 against the film 410.

[0160] A width D1 and a length L1 of the IC card 400 is 54 mm and 85.6mm respectively, for example, which are the same with those of a creditcard or a telephone card. A square electronic component 430(10), whosewidth D3 is 3 mm for example is used. A width D3 of the antenna coil 422and a width D4 of the conductor pattern 420 are 0.2 mm, for example. Theaccess terminal 432 is 15 mm square for example which is shorter than awidth of the conductor pattern 420.

[0161] A cross sectional structure of the IC card will be explained withreference to FIG. 31. The conductor pattern 420 and the antenna coil 422are printed on the film 410 of the IC card 400. On the film 410, whilethe electronic component 430 (10) is fixed with the temporally fixingfluid 440, the access terminal 432 of the electronic component 430 isdirectly connected to the conductor pattern 420, thereby beingelectrically continuous. The film 410 and a cover film 460 are laminatedand fixed using adhesives like Hot Melt in a state of putting theconductor pattern 420 and the electronic component 430 between. And onthe film 410 and the cover film 460, printed surfaces 470 and 470 for adesign and the like are printed. From above structure, a thickness H ofthe IC card 400 is realized to be approximately 0.25 mm thin.

[0162] Structural features of such IC card 400 have the followingpoints. That is, a formation of the conductor patterns 420 and 422 by aconductor paste such as Ag and Cu has a single layered structure whichis only formed on a single side of the film 410. A method triedpresently in which a conductor pattern, especially, an antenna coil isto be formed on both sides of a film can eliminate a screen-printingstep for forming a conductor pattern on the single side and a followingdrying step. In addition, with a single layer structure, the IC card canbe thinner to be 0.25 mm in thickness.

[0163] A method for fabricating an IC card will be explained withreference to FIG. 33.

[0164] A method for fabricating the IC card comprises: a printing stepP10 for forming the conductor pattern 420 and the antenna coil 422 onthe film 410 by printing in a screen-printing method, for example, withthe conductor paste Ag, Cu and the like; a drying step P20 for dryingthe conductor 420 and the antenna 422 by linearly scanning andirridating a laser beam against the printed conductor pattern 420 andthe antenna coil 422, moving the conductor pattern 420 and the antennacoil together with above mentioned film 410 and instantly evaporatingthe conductor paste; a step P40 for printing or applying a temporallyfixing agent 440 to a position to mount the electronic component (10)using a dispenser or the like; a step 50 for laminating byheating/pressing and concurrently connecting electronic component; acutting step P60 for cutting a sheet laminated in the step P50 into asize of the IC card; a step P70 for printing a design and the like 470and 472 on both sides; an inspection step P80 for inspecting reading andwriting (R/W) against the electronic elements and the like; and a stepP90 for cutting an outer shape.

[0165] As a material of the film 410, a transparent or white PET(polyethylene terephthalate), PVC (polyvinyl chloride), and plastic suchas polyimide are used. The thickness of approximately 75 μm to 100 μm,for example is used. A film is provided in the state of roll of 250 mmin width for a system of fabricating the IC card.

[0166] A printing step P10 is a step for printing many conductor pattern420 and the antenna coil 422 on a long yard film 410 corresponding tomany IC cards by a screen printing method, for example, using aconductor paste such as Ag, Cu, and the like. The following drying stepP20 is a step for heating and drying only the conductor paste such as Agby using YAG laser of 1.06 μm in wavelength since a transparent PET filmhas an absorption range in wavelength of 9 to 10 μm in case thetransparent PET film is used.

[0167] As mentioned above, by scanning linearly and irridating an energybeam such as a laser beam and a charge particle beam to the printedconductor pattern 420 and antenna coil 422, and moving the conductorpattern 420 and the antenna coil 422 together with the film 410, aplurality of the arranged conductor pattern 420 and the antenna coil 422can be dried in short time (a minute or less).

[0168] The step P30 is a step for printing and applying a temporallyfixing agent 440 to the position for mounting the electronic component430(10) using a dispenser or the like. A size for applying the agent isthe same with or little bigger than the size of the electroniccomponent. As a material of the temporally fixing fluid, a thermoplasticHot Melt which softens under 100 to 130° C. is used. UV hardening resincan be used instead of Hot Melt.

[0169] The mounting step P40 is, as mentioned above, a step forpositioning an access terminal 432 of the electronic component 430(10)such as the semiconductor chip and the like which was cut, adsorbed toan adsorption nozzle and conveyed, to a predetermined terminal part ofthe conductor pattern 420 on a film circuit board as a mounting board 30mounted on XY stages 302 and 303, and mounting the mentioned electroniccomponent 430 onto the conductor pattern 420. On the film circuit board410, the electronic component 430 is fixed on the film circuit board bythe temporally fixing fluid 440 since the temporally fixing fluid 440has been applied in the step P30. The access terminal 432 of theelectronic component 420 is formed by the ball bonding and the partother than the electronic component 420 is processed insulation with apolyimide.

[0170] The step P50 for laminating by heating/pressing and concurrentlyconnecting electronic components will be explained in the following withreference to FIGS. 34 and 35. As shown in FIG. 34, the cover film 460uses the same material having the same thickness with the film 410. Thatis, the cover film 460 uses a transparent or white PET (polyethyleneterephthalate), the thickness of which is approximately 75 μm to 100 μm.On a side of the cover film the adhesion 450 which has the thickness ofabout 80 μm, for example is pre-laminated. Hot Melt is used here as amaterial of the adhesive 450. Adhesives other than Hot Melt can be used.

[0171] A step P50 is a step for putting the film 410 mounted theelectronic component 430 (10) and the cover film 460 laminated theadhesive 450 between the hot rolls 481 and 482, and laminating the film410 and the cover film 460 by the hot rolls 481 and 482. The hot rolls481 and 482 use steel rolls thereby leveling films at the time oflaminating.

[0172] As shown in FIG. 34, here concurrently the access terminal 432 ofthe electronic 430 joins and electrically connects the conductors byengaging into the conductor pattern 420 while eliminating to thetemporally fixing fluid 440. By setting a laminating pressure to be 20kgf/cm², and a heating energy to be 130° C. for example, it is possibleto laminate the film 410 and the cover film and connect the accessterminal 432 of the electronic component 430 and the conductor pattern420 at the same time.

[0173] In comparison with a case in which an anisotropic conductiveadhesive is used for instance, the use of the temporally fixing fluid440 like Hot Melt as the adhesive agent for temporally fixing theelectronic component 430 allows the lower material cost, the connectionof the electronic component in a shorter time, and the advantage notrequiring a higher mounting accuracy for the electronic components.Besides the method by hot rolls, it is possible to use a flat press forlaminating.

[0174] By cutting the sheet laminated into a size of an IC card in thecutting step P60, printing a design and the like 470 and 472 on bothsides in the step P70, transmitting electricity by a radio to theantenna 433 by a communication inspection equipment, sending andreceiving data by a radio, testing reading and writing of electroniccomponents and the like in the inspection step P80, and cutting off anexternal shape in the step 90, the IC card 400 is completed.

[0175] In the above embodiment, the case is explained in which theconductor patterns 420 and 422 are formed by a screen-printing of theconductor paste. But the conductor patterns 420 and 422 also can beformed by etching or wires. In that case, low-melting solder of Sn/Bifamilies for example(melting point: 100-150° C.) or an In alloy layerhaving a low melting point shall be formed on the conductor pattern 420.On the other hand, by Au-plating the surface of the access terminal 432formed by boll bonding of the electronic component 430, it is possibleto have favorable joint and connection between the access terminal 432and the conductor pattern 420 by the heating/pressing step P50. As amatter of course, if the ball bonding is Au, Au-plating is notnecessary.

[0176] As mentioned, it is possible to fabricate the thin IC card 400efficiently with low cost.

[0177] According to the invention, there is an effect such that a thinsemiconductor wafer having the thickness of about 0.002 to 0.2 mm in astate where it is adhered to an adhesive sheet is diced into thinsemiconductor devices (semiconductor chips), the group of diced thinsemiconductor devices is peeled from the adhesive sheet at high speedwithout damaging or cracking the semiconductor devices, and the group ofpeeled semiconductor devices is conveyed in serial order in apredetermined unit. The semiconductor devices can be mounted on amounting board (circuit board). Consequently, a high-quality thinproduct such as an IC card can be manufactured.

[0178] According to the invention, there is an effect such that a thinsemiconductor wafer having the thickness of about 0.002 to 0.2 mm in astate where it is adhered to an adhesive sheet is diced into thinsemiconductor devices (semiconductor chips), the group of diced thinsemiconductor devices is peeled from the adhesive sheet at high speedwithout being damaged or cracked, and can be separated from the adhesivesheet.

[0179] According to the invention, there is an effect such thatelectronic devices in a state where they are adhered to an adhesivesheet are cut on a unit basis, the group of the cut electronic devicesis peeled from the adhesive sheet at high speed without damaging orcracking each electronic device and separated by the vacuum collet. Theelectronic devices can be mounted on a mounting board (circuit board).Consequently, a high-quality product can be fabricated.

[0180] According to the invention, there is an effect such that ahigh-quality thin IC card can be fabricated efficiently at low cost.

What is claimed is:
 1. A semiconductor device separating apparatus forpeeling off a group of semiconductor devices in a row, amongsemiconductor devices for an object obtained by dicing a semiconductorwafer adhered to a front face of an adhesive sheet, in such a mannerthat a member having a tip in a projecting or curved shape is pushed upagainst the back face of said adhesive sheet to thereby give tension tosaid adhesive sheet and said member is moved from one end to the otherend of the adhesive sheet.
 2. A semiconductor device separatingapparatus for peeling an adhesive sheet from a group of semiconductordevices in a row, among semiconductor devices for an object obtained bydicing a semiconductor wafer adhered to a face of the adhesive sheet, byclamping an end of said adhesive sheet and pulling said adhesive sheetat least in a direction along the face of the adhesive sheet in a statewhere said group of semiconductor devices is held by a chuck.
 3. Asemiconductor device separating apparatus for peeling a group ofsemiconductor devices, for an object obtained by dicing a semiconductorwafer adhered to a face of an adhesive sheet into semiconductor devices,by clamping an end of said adhesive sheet, and pulling said adhesivesheet at least in a direction along the face of the adhesive sheet,thereby forming a bending shape of the adhesive sheet in a state wheresaid group of semiconductor devices is held by a chuck.